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Wafer AOI Machine with 3D Robot Guidance
-- Used for inspecting defects of semiconductor chips on panel or wafer
-- 3D laser scan for panel deformation measurement to auto-focusing
-- Use CCD camera for 1um precision optical inspection
-- Auto focusing precision: 0.01 mm
-- Measurement precision: 0.001 mm
-- UPH: 7,000
Applicable Products
-- Semiconductor chips on panel or wafer
Product parameters